Abstracts

Two days, 5 themes, over 30 inspiring presentations

Presentation at Power Electronics International 2023 are grouped into 5 key themes which collectively provide complete coverage of the global power electronics industry.

If you are interested in speaking at Power Electronics International 2023, please contact info@pe-international.net or call +44 (0)24 7671 8970.

2023 Speakers Include

CISSOID
Compound Semiconductor Centre
EPC
Infineon
Innoscience Europe BV
KnowMade
Navitas
Omdia
Onsemi
PPM Systems
PureOn
SGL Carbon
Soitec
STMicroelectronics
Transphorm
Wise Integration
Yole Group

2023 Presentation Abstracts

Electric vehicles: Driving the SiC revolution
Panel Session

Does a limited supply of SiC substrates threaten to thwart a massive expansion in this industry?

Awaiting panel session abstract.

Driving the uptake of SiC in electric vehicles

Presented by Name to be advised, TBA, STMicroelectronics

TBA

High Quality SiC substrates- A need of the hour for EV revolution.

Presented by Name to be advised, TBA, PureOn

Silicon Carbide substrates are the essential starting point for Chips and devices that fuel the EV revolution. Unfortunately this part of the puzzle is still an enigma in terms of the growth of crystals, processing of the crystals into wafers and efficiently converting these substrates into devices. The current market is starved for high quality wafers and this is where the next expansion for many firms will be a focus area. Silicon carbide is a difficult material to grow and is extremely hard to cut and wafer. Technological advances in wafering are currently adopted to increase the throughput of wafers. The eco-system comprising of the Equipment makers, consumable suppliers, quality inspection are currently undergoing a technological advancements that will enable the target of 1 million 6 inch SiC wafers by 2025. We look into specific innovations of the wafering process here to understand the SiC roadmaps.

SiC Intelligent Power Modules, a system approach that lowers the barrier to entry of SiC in niche E-Mobility Applications

Presented by Pierre Delatte, CTO, CISSOID

TBA

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Presented by Name to be advised, TBA, Yole Group

TBA

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Presented by Name to be advised, TBA, Navitas

TBA

TBA

Presented by Name to be advised, TBA, SGL Carbon

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Presented by Name to be advised, TBA, Onsemi

TBA

TBA

Presented by Emmanuel Sabonnadière, VP for SiC division, Soitec

TBA

 
GaN: Carving out niches in consumer electronics
Panel Session

What's it going to take to populate our homes with products powered by GaN?

Awaiting panel session abstract.

Presentation title to be confirmed

Presented by Thierry Bouchet, CEO, Wise Integration

TBA

TBA

Presented by Denis Marcon, General Manager, Innoscience Europe BV

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Presented by Rob Harper, Programme Manager Power and RF Technologies, Compound Semiconductor Centre

TBA

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Presented by Name to be advised, TBA, Navitas

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Presented by Name to be advised, TBA, Transphorm

TBA

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Presented by Name to be advised, Yole Group

TBA

The future ecosystem for GaN electronics, from a patent perspective

Presented by Rémi Comyn, Technology & Patent Analyst, KnowMade

TBA

 
Safeguarding silicon's successes
Panel Session

Is silicon's performance finally topping out? Or could there be another breakthrough?

Awaiting panel session abstract.

Will silicon's dominance ever be threatened?

Presented by Callum Middleton, Analyst, Omdia

TBA

 
Strengthening supply chains
Panel Session

Is vertical integration always the key to success?

Awaiting panel session abstract.

TBA

Presented by Joe Petrie, TBA, PPM Systems

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Presented by Name to be advised, TBA, Yole Group

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Perfecting the package
Panel Session

Is high-performance, low-cost packaging possible?

Awaiting panel session abstract.

TBA

Presented by Peter Friedrichs, Vice President SiC, Infineon

TBA

 
Theme to be confirmed

TBA

Presented by Name to be advised, TBA, EPC

TBA