Helge Willers has served as a Sales Director for Pureon since the merger between Microdiamant and Eminess Technologies occurred at the end of 2020. He is responsible for the sales activities with customers around the world with a strong focus on customers in sophisticated industries like precision optics, automotive and semiconductor. His career spans over 28 years of industry experience in grinding and polishing of hard and brittle materials. Helge Willers graduated as an engineer at the FH Hamburg, started to work later for Saint-Gobain Abrasives and Microdiamant/Pureon.
Silicon carbide (SIC) substrates are the essential starting point for chips and devices that fuel the EV revolution. Unfortunately, this part of the puzzle is still an enigma in terms of the growth of crystals, processing of the crystals into wafers and efficiently converting these substrates into devices. The current market is starved for high quality wafers, and this is where the next expansion for many firms will be a focus area. Silicon carbide is a difficult material to grow and is extremely hard to cut and wafer. Technological advances in wafering are currently adopted to increase the throughput of wafers. The eco-system comprising of the Equipment makers, consumable suppliers, quality inspection are currently undergoing a technological advancement that will enable the target of 1 million 6 inch SiC wafers by 2025. We look into specific innovations of the wafering process here to understand the SiC roadmaps.