Monday 15th April 2024 starting at 18:30 CET

18:30 Pre-conference networking drinks reception

Tuesday 16th April 2024 starting at 08:00 CET

08:00 Registration and welcome refreshments 09:10 Housekeeping by Rob Harper - Conference Chair for the morning session Technology Developments in WBG: SiC, GaN and Beyond Sponsored by SCREEN Semiconductor Solutions Co., Ltd. 09:20 Aluminum Scandium Nitride (AlScN) a novel material for power electronic applications Presented by Ali Yassine - University Freiburg 09:40 Facing SiC Challenges Thanks to UV Laser Annealing Products from SCREEN Presented by Louis Thuries - SCREEN SPE 10:00 Cost-effective SiC substrate manufacturing for power devices enabled by oxide-free wafer bonding Presented by Dr. Bernd Dielacher - EV Group 10:20 Morning Break 11:00 SuperGaN’s Performance Advantages Challenging SiC’s Long-Term Use Presented by Philip Zuk - Transphorm 11:20 Exploring WBG's technical advances with a glimpse into next UWBG Presented by Taha Ayari - Yole Group 11:40 Electronic Packaging Materials for SiC Power Modules Presented by Dr. Michael Joerger - Heraeus Electronics 12:00 Gallium Oxide – Taking over from SiC? Presented by Martin Kuball - University of Bristol 12:20 Lunch Break 13:35 Ezgi Dogmus - Conference Chair for afternoon session 13:35 PowerElec – new metrological tools for quality control of wide bandgap semiconductors Presented by Sebastian Wood - NPL 13:55 Novel interconnect and packaging technologies for power module manufacturing Presented by Huub Claassen - Boschman Advanced Packaging Technology 14:15 SiC technology optimisation using advanced modelling tools Presented by Ahmed Nejim - Silvaco 14:35 Advanced Lapping and polishing processes for SiC Wafers for sustainable and cost effective wafers Presented by Dr. Ravi Bollina - Pureon AG 14:55 Afternoon Break Silicon MOSFETs and IGBTs: Evolving for the Future 15:35 High voltage power switch: continuous silicon development as contributor to the green transition Presented by Antonino Gaito - STMicroelectronics 15:55 Future developments within IGBTs, and how they may coexist with SiC Presented by Callum Middleton - Omdia 16:15 Closing Remarks 16:20 Networking Drinks / Dinner Reception

Wednesday 17th April 2024 starting at 08:00 CET

08:00 Registration and welcome refreshments 09:10 Housekeeping by Denis Marcon - Conference Chair for morning session System Reliability - Testing Times 09:20 SCREEN’s Sustainable Cost-of-Ownership (CoO) Portfolio for Thickness Measurement and Wafer Inspection in Power Devices, Automotive, and IoT Applications Presented by Alessandro Rossi - SCREEN SPE 09:40 Enabling Test Automation in Power Electronics Reliability Presented by Andrea Vinci - Tektronix 10:00 How to Correctly Select a High Definition Oscilloscope and Probe for SiC and GaN Power Device Measurement Accuracy Presented by Maurizio Mastrofini - Teledyne LeCroy Capacity Across the Supply Chain 10:20 The Power Play : Unveiling Capacity Challenges in SiC and GaN Industries Presented by Ezgi Dogmus - Yole Group 10:40 Morning Break GaN - Widening the Application Space 11:20 How to unleash the power savings of GaN in high power, high voltage applications Presented by Rupert Baines - QPT 11:40 New Opportunities for Gallium Nitride in Power, Sensing and RF Presented by Rob Harper - Compound Semiconductor Centre 12:00 Activating GaN’s Full Potential with Digital Control for Enhanced Performance Across All Electronics Sectors Presented by Thierry Bouchet - Wise Integration 12:20 Price competitive GaN power devices to enhance performances, shrinking size and lowering cost of power conversion solutions Presented by Denis Marcon - Innoscience Europe BV 12:40 GaN is widening the applications field in power electronics Presented by Eric Moreau - STMicroelectronics 13:00 Bi-directional circuits open up new opportunities in off-grid applications Presented by Alfred Hesener - Navitas 13:20 Lunch Break Upgrading the GRID – The Role of Power Electronics (inc. Energy Waste and Efficiency) 14:35 Peter Friedrichs - Conference Chair for afternoon session 14:35 High-Voltage Silicon Carbide Enables an Omnidirectional Grid Presented by Kevin Speer - Microchip 14:55 The grid of the future and how SiC power devices will enable the transition towards zero CO2 Presented by Peter Friedrichs - Infineon 15:15 3.3 kV SiC MOSFETs Accelerate Grid-Connected Energy Storage Presented by Ranbir Singh - Navitas 15:35 Closing Remarks